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Soldering methods and techniques of printed circuit boards
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Soldering methods and techniques of printed circuit boards

  • Categories:Company News
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  • Time of issue:2020-12-12
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(Summary description)
Welding techniques and techniques for printed circuit board welding. 1 Wetting effect" When hot liquid solder dissolves and penetrates to the surface of the metal to be soldered, it is called metal dipping or metal dipping. The molecules of the mixture of solder and copper form a new alloy partly made of copper and partly soldered. This solvent action is called tin dip, which forms intermolecular bonds between various parts to form a metal alloy eutectic. The formation of good intermolecular bonds is the core of the welding process, which determines the strength and quality of the welding joint. Only the surface of copper is not polluted, and there is no oxide film formed by exposure to the air to be wetted with tin, and the solder and working surface need to reach an appropriate temperature.

Soldering methods and techniques of printed circuit boards

(Summary description)
Welding techniques and techniques for printed circuit board welding. 1 Wetting effect" When hot liquid solder dissolves and penetrates to the surface of the metal to be soldered, it is called metal dipping or metal dipping. The molecules of the mixture of solder and copper form a new alloy partly made of copper and partly soldered. This solvent action is called tin dip, which forms intermolecular bonds between various parts to form a metal alloy eutectic. The formation of good intermolecular bonds is the core of the welding process, which determines the strength and quality of the welding joint. Only the surface of copper is not polluted, and there is no oxide film formed by exposure to the air to be wetted with tin, and the solder and working surface need to reach an appropriate temperature.

  • Categories:Company News
  • Author:
  • Origin:
  • Time of issue:2020-12-12
  • Views:0
Information

Welding techniques and techniques for printed circuit board welding. 1 Wetting effect" When hot liquid solder dissolves and penetrates to the surface of the metal to be soldered, it is called metal dipping or metal dipping. The molecules of the mixture of solder and copper form a new alloy partly made of copper and partly soldered. This solvent action is called tin dip, which forms intermolecular bonds between various parts to form a metal alloy eutectic. The formation of good intermolecular bonds is the core of the welding process, which determines the strength and quality of the welding joint. Only the surface of copper is not polluted, and there is no oxide film formed by exposure to the air to be wetted with tin, and the solder and working surface need to reach an appropriate temperature.

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